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Chip bonding of low-melting eutectic alloys by transmitted laser radiation

Autoren:Hoff, C.; Venkatesh, A.; Schneider, A.; Hermsdorf, J.; Bengsch, S.; Wurz, M. C.; Kaierle, S.; Overmeyer, L.
Kategorie:Zeitschriften/Aufsätze (reviewed)
Veröffentlichung:Advanced Optical Technologies, ISSN (Online) 2192-8584, ISSN (Print) 2192-8576. De Gruyter.
DOI:DOI 10.1515/aot-2017-0011


Present-day thermode bond systems for the assembly of radio-frequency identification (RFID) chips are mechanically inflexible, difficult to control, and will not meet future manufacturing challenges sufficiently. Chip bonding, one of the key processes in the production of integrated circuits (ICs), has a high potential for optimization with respect to process duration and process flexibility. For this purpose, the technologies used, so far, are supposed to be replaced by a transmission laserbonding process using low-melting ...