Surface Integration of Optoelectronic Components and Polymer Optical Waveguides in Planar Optronic Systems

Planar optronic systems with a high density of integrated optoelectronic and optical components can be widely adopted in diverse applications for effective sensing, signal processing and data transmission. However, their integration in optronic systems remains challenging, particularly in individual positioning and entire assembly accuracy. In this work, we introduce a bonding technique named optodic bonding for mounting and contacting optoelectronic components as well as an automated surface integration technique for handling and fabricating polymer waveguides. A study focusing on the positioning and assembly accuracy regarding the process parameters and their influences is conducted. The feasibility and reliability of the assembly using both techniques for realizing an accurate integration is discussed.

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