Direct Dispensing of Light Guiding Structures

The application of optical structures in data transfer and measurement steadily increases. Optical fibres in WAN (Wide Area Networks) and LAN (Local Area Network) are state of the art. Polymer optical fibres (POFs) are superior to electrical conductors, due to their light weight, their resistance to damage and electromagnetic interference. Just like their glass equivalents they provide a high data transfer rate. Optical wave-guides as interconnects in photonic packages for data- and telecom as well as for sensors are still a research topic. Wave-guides can be produced by hot embossing, lithography and laser technology. Multimode wave-guide structures created by these processes are integrated into a thin optical foil which can be laminated into a printed circuit board. Another approach in electronic packaging is the 3D-moulded interconnected device. Here, the electrical circuit is part of the device itself. However, there has not been a flexible production method for applying light guiding structures on a threedimensional surface, yet.