Publikationen

Overmeyer, L.; Gottwald, S. N.; Springer, M.; Düsing, J. F. (2022): On-the-fly bare die bonding based on laser induced forward transfer (LIFT),  CIRP Annals, Volume 71, Issue 1, Pages 41-44
DOI: 10.1016/j.cirp.2022.03.042

J. Fottner, D. Clauer, F. Hormes, M. Freitag, T. Beinke, L. Overmeyer, S. N. Gottwald, R. Elbert, T. Sarnow, T. Schmidt, K.-B. Reith, H. Zadek, F. Thomas (2021): Autonomous Systems in Intralogistics – State of the Art and Future Research Challenges,  Logistics Research 14:2
DOI: 10.23773/2021_2

Gottwald, S. N.; Reitz, B.; Albrecht, D.; Overmeyer, L. (2020): Concept of a Bonding Technology for Dies below 150 Micrometers,  Procedia Manufacturing, Volume 52, Pages 9-13
DOI: 10.1016/j.promfg.2020.11.003
ISSN: 2351-9789

Reitz, B.; Hoffmann, G.-A.; Gottwald, S. N.; Overmeyer, L. (2021): Fabrication of an integrated optical system in glass using laser assisted manufacturing,  Proceedings Volume 11815, Novel Optical Systems, Methods, and Applications XXIV; 118150B
DOI: 10.1117/12.2596376

Gottwald, S.; Overmeyer, L. (2018): Control concept of an ultra-fast assembly technology for electronic components,  AST – Symposium on Automated Systems and Technologies, Band 3/2018, PZH Verlag, Garbsen, 2018, S. 67-72. Weitere Informationen
ISBN: 978-3-95900-223-3

Gottwald, S. (2019): 28 Chips pro Sekunde: Mikrobestückung per Laser,  PZH Magazin 2019
ISBN: 978-3-959-310-0

Gottwald, S.; Overmeyer, L. (2019): Ultraschnelle Bestückung durch konsistente Kinematik,  Phi – Produktionstechnik Hannover informiert Weitere Informationen
ISBN: 2198-1922