in HIS-LSF
Type of lecture | Lecture + Exercise |
Level | Master |
Semester | Winter semester |
Creditpoints | 5 CP |
TOPICS
Students have gained knowledge about product manufacturing techniques of semiconductor
components and Microsystems. The focus is on the back-end-process, the production and cutting of
wafers. Techniques like the machining of wafers, bonding (die-, wire-, flip-chip-), Burn-In and packaging of components with special consideration of optoelectronical components will be taught.
Furthermore, application-specific assembly techniques as well as methods for integrating electronical and microtechnological systems will be dealt with.
YOUR SUPERVISOR AND CONTACT PERSON


M. Sc. Uliana Dudko
Doktorandinnen und Doktoranden
Optronik
Telefon
Fax
Adresse
An der Universität 2
30823 Garbsen
30823 Garbsen
Gebäude
Raum


M. Sc. Uliana Dudko
Doktorandinnen und Doktoranden
Optronik
YOUR PROFESSOR


Prof. Dr.-Ing. Ludger Overmeyer
Professorinnen und Professoren


Prof. Dr.-Ing. Ludger Overmeyer
Professorinnen und Professoren