Description
This research combines laser sintering and cleaning for the additive manufacturing of copper conductors on three-dimensional (3D) components. An application example shows the production of a conductive copper grid on a 3D antenna cover. The approach consists of full-surface coating with a primer and copper ink layer, followed by laser processing. The primer is applied to compensate for surface defects, ensure adequate insulation, and achieve thermal stability. Laser sintering creates conductive traces using the copper ink coating. In the last step of the production, laser cleaning removes the remaining non-sintered ink to ensure optimal electromagnetic characteristics. Finally, the 3D sintered conductive trace grids on an acrylonitrile butadiene styrene component result in an electrical resistance lower than 15 Ω across the grid.
