Description
This paper presents a novel 3D multilayer device technology classification to compare existing approaches in the field and the first demonstrators fabricated using the multilayer printing approach. The circuit and application designs demonstrated, together with the manufacturing analysis and discussion, provide a basis for further development in this area. The demonstrators showcased cover a range of applications, including double-layer resonant circuits, multidirectional lighting devices with a high density of light-emitting diodes, microcontroller circuits, and five-layer area arrays with 100 densely arranged contact pads. Assembly processes of electric components are possible by using conductive adhesives for temperature-sensitive polymer samples and low-temperature solder paste for temperature-resistant samples. The process compatibility with additive-manufactured components from a 3D printer offers a high level of adaptability for future applications. The main practical focus of this paper is on the layout generation and dimensioning of the spatial printed circuit layout while taking maximum currents into account and ensuring the highest possible long-term stability. Laboratory test productions provide an initial proof of concept.
