Research Projects

  • 3D-multi layer prints of Mechatronic Integrated Devices
    In the 3D-MLD project, additive manufacturing for the generative production of multilayer circuits on spatial components is investigated. The novel approach is based on an alternating coating of the component surface with functional inks and local laser processing. Besides the laser sintering of conductor paths, laser ablation of the insulating coating enables the generation of vertical interconnect accesses in between the layers.
    Leaders: Ejvind Olsen
    Year: 2021
    Sponsors: BMWi
    Lifespan: 04/2021 – 03/2023
  • 3D-CopperPrint
    3D-CopperPrint investigates the use of additive manufacturing (3D printing) for the generation of copper interconnects on adaptive spatial circuit carriers. This process can be used to fabricate hybrid electro-mechanical components as an alternative to existing methods. The approach is based on the application of copper-filled coatings on the surface of three-dimensional objects and the subsequent photothermal laser sintering of the paths.
    Team: Ejvind Olsen
    Year: 2018
    Sponsors: BMWi, AiF (IGF)
    Lifespan: 10/2018 – 06/2020