Production of Optoelectronic Systems

Type of lecture
Lecture + Exercise
Level Master
SemesterWinter semester
Creditpoints
5 CP

Topics

Students have gained knowledge about product manufacturing techniques of semiconductor

components and Microsystems. The focus is on the back-end-process, the production and cutting of

wafers. Techniques like the machining of wafers, bonding (die-, wire-, flip-chip-), Burn-In and packaging of components with special consideration of optoelectronical components will be taught.

Furthermore, application-specific assembly techniques as well as methods for integrating electronical and microtechnological systems will be dealt with.

Your supervisor and contact person

Your professor

Prof. Dr.-Ing. Ludger Overmeyer
Professors
Prof. Dr.-Ing. Ludger Overmeyer
Professors