Eutectic Bonding
| Kategorien |
Zeitschriften/Aufsätze (reviewed) |
| Jahr | 2014 |
| Autorinnen/Autoren | Overmeyer, L. ; Wang, Y. ; Wolfer, T. |
| Veröffentlicht in | CIRP Encyclopedia of Production Engineering. Berlin: Springer, S. 488-492 - ISBN 978-3-642-20616-0 |
Beschreibung
Eutectic bonding is a bonding method based on the melting of a metallic intermediate layer of eutectic alloy composition which is used for chip bonding and wafer bonding. [321]
| DOI | 10.1007/978-3-642-20617-7_6483 |
