Logo Leibniz Universität Hannover
Logo: ITA
Logo Leibniz Universität Hannover
Logo: ITA
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Bonding technologies

The bonding of dice is realized in flip-chip or wire-bonding processes. The ITA offers the manufacturing of prototypes and small proof of concept series. Moreover, the ITA has experiences with the realization of adhesive connections for mechanical, electrical, optical and thermal contact.

Wire-Bonder
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