Chip-on-Flex Packaging of Optoelectronic Devices in Polymer-Based Optical Interconnects

Chip-on-Flex Packaging of Optoelectronic Devices in Polymer-Based Optical Interconnects

Kategorien Zeitschriften/Aufsätze (reviewed)
Jahr 2018
Autoren Wang, Y.; Overmeyer, L.
Veröffentlicht in IEEE Journal of Selected Topics in Quantum Electronics.

A variety of applications in the use of optical and optoelectronic devices as well as their integrated circuits are increasingly penetrating into our daily routine. One of the most demanding fields is the sensing engineering. Being distinguished from the conventional sensors based on electronics, optical sensors exhibit an extensive potential regarding a high-speed data transfer and electromagnetic interference resistance. Meanwhile, the demand for more mechanical flexibility of systems and lower manufacturing budgets is continuously growing. Since the optical transparency is desired for coupling and transmission of optical signals, cost-effective transparent polymeric films are the promising candidates as carrier substrates. In this work, we aim to establish short-distance planar optical interconnects consisting of light sources/detectors and waveguides on the flexible transparent polymeric films for optical sensing functions. To achieve a miniaturized structure and ensure the flexibility of interconnects, bare chips of optoelectronic light sources/detectors are employed. Here, packaging of these chips carries the burden of all responsibilities in terms of ensuring the mechanical strength, electrical connection, thermal stability as well as the optical performance. It leads to the concept of chip-on-flex (CoF) packaging of optoelectronic devices


DOI 10.1109/JSTQE.2018.2827674