Simulative Investigations of the Mechanical Reliability of the Flexible Optoelectronic Packaging Using Optodic Bonding

Simulative Investigations of the Mechanical Reliability of the Flexible Optoelectronic Packaging Using Optodic Bonding

Kategorien Konferenz (reviewed)
Jahr 2016
Autoren Wang, Y.; Yang, X.; Overmeyer, L.
Veröffentlicht in 66th Electronic Components and Technology Conference (ECTC), 06.2016, IEEE, Las Vegas.

With the constant innovation and development of the advanced materials and technologies in the field of optoelectronics, a variety of applications adopting the benefits of optoelectronics is increasingly penetrating into our daily routines. The way of packaging has a huge impact on the performance of optoelectronics in mechanical, electrical as well as optical properties. Particularly, flexible packaging is becoming a trend thanks to its compatibility to any irregular surfaces in diverse applications. By employing transparent polymer foils, such as polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET), as carrier substrates for optoelectronic packaging, a greater mechanical flexibility can be achieved. Their transparency expands the range of application, for instance in optical sensing areas. In addition, they are mostly cost-effective, which enables an economical roll-to-roll manufacturing process. However, the challenge of using them is their low glass transition temperatures. In previous works, a novel optodic bonding process employing UV curable adhesives for processing these thermally sensitive polymer foils was introduced and verified as a promising technology for flexible optoelectronic packaging. In this work, we conduct further investigations of its mechanical reliability with the focus on the aspect of flexibility. FEM-based simulations for emulating various mechanical loadings including shear, bending and tensile stresses are implemented. We perform analyses of the influencing factors, particularly their degree of efficiency on the mechanical stability, e.g. the material properties of the optoelectronic components, the employed polymers as well as the bonding adhesives. These comprehensive investigations establish a constructive guideline for choosing materials for flexible optoelectronic packaging. In addition to this, we attain a convincing statement for the reliable feasibility of the optodic bonded packages with respect to a sufficient mechanical flexibility and stability.



DOI 10.1109/ECTC.2016.216