ForschungPublikationen
Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems

Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems

Kategorien Konferenz (reviewed)
Jahr 2015
Autoren Wang, Y.; Akin, M.; Jogschies, L.; Overmeyer, L.; Rissing, L.
Veröffentlicht in Proc. SPIE 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII, 936609 (February 27, 2015), San Francisco, California, United States.
Beschreibung

In the field of modern information technology, optoelectronics are being widely used, and play an increasingly important role. Meanwhile, the demand for more flexible circuit carriers is rapidly growing, since flexibility facilitates the realization of diverse functions and applications. As a potential candidate, transparent polymer substrates with a thickness of about a hundred micrometers by virtue of their low cost and sufficient flexibility are getting more attention. Thus, accomplishing an integration of optoelectronic components into polymer based flexible circuit systems increasingly is becoming an attractive research topic, which is of great significance for future information transmission and processing. We are committed to developing a new microchip bonding process to realize it. Taking into account the fact that most economical transparent polymer substrates can only be processed with restricted thermal loading, we designed a so-called optode instead of a widely adopted thermode. We employ UV-curing adhesives as bonding materials; accordingly, the optode is equipped with a UV irradiation source. An investigation of commercial optoelectronic components is conducted, in which their dimensions and structures are studied. While selecting appropriate transparent polymer substrates, we take their characteristics such as UV transmission degree, glass transition temperature, etc. as key criterions, and choose polyethylene terephthalate (PET) and polymethyl methacrylate (PMMA) as carrier materials. Besides bonding achieved through the use of adhesives cured by the optode, underfill is accordingly employed to enhance the reliability of the integration. We deposit electrical interconnects onto the polymeric substrate to be able to bring the optoelectronic components into electrical operation. In order to enlarge the optical coupling zone from component to substrate within the proximity of the adhesive or underfill, we employ transparent interconnects made of indium-tin-oxide. We present the results of the performance tests, including the contact resistances, mechanical tests and environmental tests. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

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DOI 10.1117/12.2077072