ForschungPublikationen
Eutectic Bonding

Eutectic Bonding

Kategorien Zeitschriften/Aufsätze (reviewed)
Jahr 2014
Autoren Overmeyer, L. ; Wang, Y. ; Wolfer, T.
Veröffentlicht in CIRP Encyclopedia of Production Engineering. Berlin: Springer, S. 488-492 - ISBN 978-3-642-20616-0
Beschreibung

Eutectic bonding is a bonding method based on the melting of a metallic intermediate layer of eutectic alloy composition which is used for chip bonding and wafer bonding. [321]

DOI 10.1007/978-3-642-20617-7_6483