ForschungPublikationen
Packaging of Electronic Components for High Temperature Applications

Packaging of Electronic Components for High Temperature Applications

Kategorien Konferenz
Jahr 2012
Autoren Krühn, T.
Veröffentlicht in 3rd European Geothermal PhD day: European Energy Research Alliance
Beschreibung

The exploration of deep geothermal resources is still very expensive. The high price results from a high failure risk, slow drilling progress and a large amount of manual work. One step to achieve lower costs is to monitor and automate the drilling process. Therefore, electronic components such as sensors and data processing units must be integrated into the Bottom Hole Assembly (BHA).

The integration of electronics into the BHA faces the challenge of high ambient temperatures. The project “Packaging of Electronic Components for High Temperature Applications” within the “Geothermal Energy and High Performance-Drilling Collaborative Research Program (gebo)” develops a system of heat carrier channels integrated in printed circuit boards (PCB). These channels can be perfused with fluids and provide high heat convection rates. Such PCBs will be able to withstand high ambient temperatures up to 250 °C.

With the proposed cooling system, it is possible to integrate microelectronic components into the BHA for drilling applications in hot rock. Sensors and data processing units for measurement and logging can be used while drilling, thus providing a better data source for automation, navigation and planning. This will help to optimize drilling costs and to minimize failure risks.