ForschungPublikationen
Flip-chip die bonding on thin reel-to-reel antenna substrates for low cost UHF transponders

Flip-chip die bonding on thin reel-to-reel antenna substrates for low cost UHF transponders

Kategorien Konferenz
Jahr 2006
Autoren Franke, S.; Overmeyer, L.; Fahlbusch, T.
Veröffentlicht in Proceedings of the Micropackaging Conference 2006 of ARCSIS. STUniversity, 2006.
Beschreibung

Laser structuring offers the possibility to produce geometrically high qualitative strip line configurations. Structure widths and gaps of less than 15 µm can be achieved by this procedure. Furthermore, the production can be realised as a reel-to-reel operation. The fast process time allows machining of 1 km substrate in less than 15 min. Followed by an electroplating process, antenna substrates and interposer substrates can be built on a variety of carrier materials. The following article describes the manufacturing of RFID tags using laser structured substrates and flip-chip technology. The application of non-conductive adhesive (NCA) as well as anisotropic-conductive-adhesive (ACA) for the bonding process are analyzed as.