ForschungPublikationen
Packaging of optoelectronic devices for half duplex communication in surface-integrated polymer-optical fibres

Packaging of optoelectronic devices for half duplex communication in surface-integrated polymer-optical fibres

Kategorien Konferenz (reviewed)
Jahr 2008
Autoren Overmeyer, L.; Dumke, M.
Veröffentlicht in Micropackaging conference of ARCSIS. STUniversity Fuveau, France, 2008.