ForschungPublikationen
Concept of a Bonding Technology for Dies below 150 Micrometers

Concept of a Bonding Technology for Dies below 150 Micrometers

Kategorien Zeitschriften/Aufsätze (reviewed)
Jahr 2020
Autoren Gottwald, S. N.; Reitz, B.; Albrecht, D.; Overmeyer, L.
Veröffentlicht in Procedia Manufacturing, Volume 52, Pages 9-13
Beschreibung

Due to rising demand for electrically contacted bare dies, bonding rates are to be increased. Technically, however, current bonding processes are almost at their limit. The use of continuous and consistent kinematics of the carrier substrate which allows no mechanical forces during die transfer is made possible by an optically induced, contactless transfer of the dies. The transfer can be triggered with an 8 ns laser impulse at a wavelength of 1064 nm, which detaches dies from a glass wafer and attaches them onto a carrier substrate.

ISSN 2351-9789
DOI 10.1016/j.promfg.2020.11.003