in HIS-LSF
Type of lecture | Lecture + Exercise |
Level | Master |
Semester | Winter semester |
Creditpoints | 5 CP |
Topics
Students have gained knowledge about product manufacturing techniques of semiconductor
components and Microsystems. The focus is on the back-end-process, the production and cutting of
wafers. Techniques like the machining of wafers, bonding (die-, wire-, flip-chip-), Burn-In and packaging of components with special consideration of optoelectronical components will be taught.
Furthermore, application-specific assembly techniques as well as methods for integrating electronical and microtechnological systems will be dealt with.
Your supervisor and contact person
Your professor
![](/typo3temp/assets/_processed_/c/a/csm_5b737774836104431654b6a1ff59d869c578c57c-fp-3-2-0-0_a62b39fd23.jpg)
![](/typo3temp/assets/_processed_/c/a/csm_5b737774836104431654b6a1ff59d869c578c57c-fp-3-2-0-0_cd99f4bf65.jpg)
Prof. Dr.-Ing. Ludger Overmeyer
Professorinnen und Professoren
![](/typo3temp/assets/_processed_/c/a/csm_5b737774836104431654b6a1ff59d869c578c57c-fp-3-2-0-0_a62b39fd23.jpg)
![](/typo3temp/assets/_processed_/c/a/csm_5b737774836104431654b6a1ff59d869c578c57c-fp-3-2-0-0_cd99f4bf65.jpg)
Prof. Dr.-Ing. Ludger Overmeyer
Professorinnen und Professoren